Physical layer
Understand computer hardware technology, processors, memory, storage, semiconductors, interconnects, power delivery, cooling, and performance bottlenecks.
ExplainerA chiplet is only one part of a processor plan. The package, die-to-die link, test strategy, and thermal design determine whether modular silicon becomes a useful system.
ExplainerCo-packaged optics moves optical connections from the switch faceplate toward the switching silicon. That can shorten demanding electrical paths, while moving new reliability, cooling, and maintenance questions into the package.
AnalysisRISC-V makes an instruction-set architecture available as an open standard. It does not provide a finished processor, a verified system-on-chip, or an automatic software ecosystem for every custom extension.
ExplainerYield is the share of manufactured devices that meet specification. Because each wafer contains many opportunities for variation, small changes in defect control and measurement can materially alter usable output and learning speed.
AnalysisHBM and CXL address different parts of a memory-system problem. HBM brings tightly coupled, wide-interface memory near compute; CXL defines coherent links and fabric capabilities for attached memory and devices.
GuideA processor is not only a compute device. Its useful performance depends on clean power delivery, controlled temperature, firmware limits, and the surrounding board, chassis, and facility environment.
AnalysisSilicon photonics integrates optical functions with semiconductor manufacturing techniques. Its promise is not that light replaces every electrical path, but that selected communication links can move more information with different bandwidth, reach, and energy trade-offs.
NewsThe industry’s three-month moving average reached $146.8 billion, with month-to-month gains reported across every listed region.